Power chips are linked to external circuits via product packaging, and their performance depends upon the support of the product packaging. In high-power circumstances, power chips are typically packaged as power modules. Chip affiliation refers to the electric link on the top surface area of the chip, which is generally aluminum bonding cable in typical components. ^
Typical power module package cross-section
Presently, business silicon carbide power components still primarily use the product packaging technology of this wire-bonded typical silicon IGBT module. They deal with problems such as large high-frequency parasitical criteria, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation strength, which limit the use of silicon carbide semiconductors. The display of superb performance. In order to address these troubles and totally manipulate the huge prospective benefits of silicon carbide chips, many new product packaging innovations and options for silicon carbide power components have arised in recent years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cables to copper wires, and the driving pressure is cost decrease; high-power devices have developed from light weight aluminum cords (strips) to Cu Clips, and the driving force is to improve product efficiency. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding packaging approaches, Cu Clip modern technology has the complying with advantages:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a certain extent, replaces the conventional cable bonding method between the chip and the pins. As a result, a distinct package resistance value, greater present circulation, and better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can fully save the expense of silver plating and bad silver plating.
3. The item look is totally consistent with typical products and is generally used in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding approach is extra pricey and intricate, but it can achieve much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad uses a Clip method, and the Gate uses a Wire technique. This bonding method is a little less costly than the all-copper bonding technique, saving wafer location (suitable to really tiny gateway locations). The procedure is simpler than the all-copper bonding method and can get far better Rdson and much better thermal impact.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price per ounce, please feel free to contact us and send an inquiry.
Inquiry us
